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FSBB30CH60F Tech Specifications

ON Semiconductor  FSBB30CH60F technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status LAST SHIPMENTS (Last Updated: 2 days ago)
Factory Lead Time 17 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case 27-PowerDIP Module (1.205, 30.60mm)
Number of Pins 27Pins
Weight 13.32g
Collector-Emitter Breakdown Voltage 600V
Series Motion SPM® 3
Published 2007
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 27Terminations
ECCN Code EAR99
Type IGBT
Terminal Finish Tin (Sn)
Max Operating Temperature 125°C
Min Operating Temperature -20°C
Terminal Position DUAL
Number of Functions 1Function
Base Part Number FSBB30CH60
Number of Outputs 1Output
Voltage - Isolation 2500Vrms
Output Voltage 800mV
Configuration 3 Phase
Max Supply Voltage 450V
Max Current Rating 30A
Nominal Supply Current 500μA
Power Dissipation 103W
Output Current 5mA
Collector Emitter Voltage (VCEO) 2.75V
Max Collector Current 30A
Min Breakdown Voltage 600V
Height 4.5mm
Length 44mm
Width 27mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
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FSBB30CH60F Documents

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