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FSBB30CH60DF Tech Specifications

ON Semiconductor  FSBB30CH60DF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE, NOT REC (Last Updated: 2 days ago)
Factory Lead Time 14 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case 27-PowerDIP Module (1.205, 30.60mm)
Weight 21.978g
Series Motion SPM® 3
Published 2016
JESD-609 Code e3
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type IGBT
Terminal Finish Tin (Sn)
Max Operating Temperature 150°C
Min Operating Temperature -40°C
HTS Code 8541.29.00.95
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage - Isolation 2500Vrms
Configuration 3 Phase Inverter
Max Current Rating 30A
Collector Emitter Voltage (VCEO) 2.1V
Min Breakdown Voltage 600V
RoHS Status ROHS3 Compliant
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FSBB30CH60DF Documents

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