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FSB50825AT Tech Specifications
ON Semiconductor FSB50825AT technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 8 Weeks | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Package / Case | 23-PowerDIP Module (0.748, 19.00mm) | |
| Weight | 5.99g | |
| Series | Motion SPM® 5 | |
| Published | 2017 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Number of Terminations | 23Terminations | |
| ECCN Code | EAR99 | |
| Type | MOSFET | |
| Terminal Finish | Tin (Sn) | |
| Max Operating Temperature | 150°C | |
| Min Operating Temperature | -40°C | |
| Additional Feature | CONTROL SUPPLY VOLTAGE(VCC)= 15V | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | DUAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Supply Voltage | 150V | |
| Reach Compliance Code | not_compliant | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | R-XDMA-T23 | |
| Voltage - Isolation | 1500Vrms | |
| Supply Voltage-Max (Vsup) | 200V | |
| Configuration | 3 Phase Inverter | |
| Max Current Rating | 3.6A | |
| Output Current-Max | 9A | |
| Min Breakdown Voltage | 250V | |
| Length | 29mm | |
| Height Seated (Max) | 3.3mm | |
| Width | 12mm | |
| RoHS Status | Non-RoHS Compliant |
FSB50825AT Documents
Download datasheets and manufacturer documentation for FSB50825AT
- DatasheetsFSB50825A,AT
- PCN Assembly/OriginHDG4/HDG4D Wafer Fab Chg 22/Oct/2018
- ReachStatementFairchild-Semiconductor-FSB50825AT.pdf
- Environmental InformationMaterial Declaration FSB50825AT
- PCN Design/SpecificationLogo 17/Aug/2017
- PCN PackagingMult Devices 24/Oct/2017
- TechnicalDrawingFairchild-Semiconductor-FSB50825AT.pdf
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