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FSB50825AB Tech Specifications
ON Semiconductor FSB50825AB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 1 day ago) | |
| Factory Lead Time | 8 Weeks | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Package / Case | 23-PowerDIP Module (0.644, 16.35mm) | |
| Weight | 0g | |
| Series | Motion-SPM® | |
| Published | 2017 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 21Terminations | |
| Type | MOSFET | |
| Terminal Finish | Tin (Sn) | |
| Terminal Position | DUAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Supply Voltage | 150V | |
| Reach Compliance Code | not_compliant | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | R-XDMA-T21 | |
| Voltage - Isolation | 1500Vrms | |
| Configuration | 3 Phase | |
| Voltage | 250V | |
| Current | 3.6A | |
| Length | 29mm | |
| Height Seated (Max) | 3.3mm | |
| Width | 12mm | |
| RoHS Status | ROHS3 Compliant |
FSB50825AB Documents
Download datasheets and manufacturer documentation for FSB50825AB
- DatasheetsFSB50825AB FSB50825AB-ON-Semiconductor-datasheet-85544540.pdf FSB50825AB-Fairchild-Semiconductor-datasheet-62269920.pdf
- PCN Assembly/OriginWafer Fab Update 24/Mar/2017
- RohsStatementFairchild-Semiconductor-FSB50825AB.pdf
- Environmental InformationMaterial Declaration FSB50825AB
- PCN Design/SpecificationLogo 17/Aug/2017
- PCN PackagingMult Devices 24/Oct/2017
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