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FSB50550AS Tech Specifications
ON Semiconductor FSB50550AS technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 1 day ago) | |
| Factory Lead Time | 8 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 23-PowerSMD Module, Gull Wing | |
| Number of Pins | 23Pins | |
| Weight | 3.864g | |
| SwitchingFrequency | 15kHz | |
| Packaging | Cut Tape (CT) | |
| Series | Motion SPM® 5 | |
| Published | 2014 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 23Terminations | |
| ECCN Code | EAR99 | |
| Type | MOSFET | |
| Terminal Finish | Tin (Sn) | |
| Max Operating Temperature | 150°C | |
| Min Operating Temperature | -40°C | |
| HTS Code | 8541.29.00.95 | |
| Max Power Dissipation | 14.5W | |
| Terminal Position | DUAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Supply Voltage | 15V | |
| Reach Compliance Code | not_compliant | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Base Part Number | FSB50550 | |
| Number of Outputs | 3Outputs | |
| Qualification Status | Not Qualified | |
| Voltage - Isolation | 1500Vrms | |
| Power Supplies | 15V | |
| Configuration | 3 Phase | |
| Max Supply Voltage | 16.5V | |
| Min Supply Voltage | 13.5V | |
| Max Current Rating | 1.2A | |
| Operating Supply Current | 200μA | |
| Current | 2A | |
| Collector Emitter Voltage (VCEO) | 500V | |
| Max Collector Current | 2A | |
| Min Breakdown Voltage | 500V | |
| Height | 3.3mm | |
| Length | 29.2mm | |
| Width | 12.2mm | |
| RoHS Status | ROHS3 Compliant |
FSB50550AS Documents
Download datasheets and manufacturer documentation for FSB50550AS
- DatasheetsFSB50550AS-ON-Semiconductor-datasheet-85544401.pdf FSB50550AS FSB50550AS-ON-Semiconductor-datasheet-33174764.pdf
- PCN Design/SpecificationMarking Chg 04/May/2016 Logo 17/Aug/2017
- PCN Assembly/OriginHDG4/HDG4D Wafer Fab Chg 22/Oct/2018
- Environmental InformationMaterial Declaration FSB50550AS
- ReachStatementFairchild-Semiconductor-FSB50550AS.pdf
- PCN PackagingMult Devices 24/Oct/2017
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