In Stock
:
14837 Min. : 1
Mult. : 1
Not available to buy on line? Want the lower wholesale price? Please
sendRFQ, we will
respond immediately
FSB50550AB Tech Specifications
ON Semiconductor FSB50550AB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 1 day ago) | |
| Factory Lead Time | 10 Weeks | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Package / Case | 23-PowerDIP Module (0.644, 16.35mm) | |
| Weight | 0g | |
| Series | Motion-SPM® | |
| Published | 2017 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 21Terminations | |
| Type | MOSFET | |
| Terminal Finish | Tin (Sn) | |
| Terminal Position | DUAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Supply Voltage | 300V | |
| Reach Compliance Code | not_compliant | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | R-XDMA-T21 | |
| Voltage - Isolation | 1500Vrms | |
| Configuration | 3 Phase | |
| Voltage | 500V | |
| Current | 2A | |
| Length | 29mm | |
| Height Seated (Max) | 3.3mm | |
| Width | 12mm | |
| RoHS Status | ROHS3 Compliant |
FSB50550AB Documents
Download datasheets and manufacturer documentation for FSB50550AB
- DatasheetsFSB50550AB-ON-Semiconductor-datasheet-85544401.pdf FSB50550AB FSB50550AB-Fairchild-Semiconductor-datasheet-62269917.pdf
- PCN Assembly/OriginWafer Fab Update 24/Mar/2017
- RohsStatementFairchild-Semiconductor-FSB50550AB.pdf
- Environmental InformationMaterial Declaration FSB50550AB
- PCN Design/SpecificationLogo 17/Aug/2017
- PCN PackagingMult Devices 24/Oct/2017
Index :
0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ



