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FSA8108BUCX Tech Specifications

ON Semiconductor  FSA8108BUCX technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status LAST SHIPMENTS (Last Updated: 1 week ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 12-UFBGA, WLCSP
Number of Pins 12Pins
Weight 63mg
Packaging Tape & Reel (TR)
Published 2016
JESD-609 Code e1
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 12Terminations
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Applications Cell Phone
HTS Code 8542.39.00.01
Voltage - Supply 2.7V~4.5V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 3.8V
Terminal Pitch 0.4mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number FSA8108
Output SEPARATE OUTPUT
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 4.5V
Power Supplies 2.7/4.5V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7V
Analog IC - Other Type ANALOG CIRCUIT
On-State Resistance (Max) 2.5Ohm
Switching BREAK-BEFORE-MAKE
Normal Position NO
Height 378μm
Length 1.56mm
Width 1.16mm
RoHS Status RoHS Compliant
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FSA8108BUCX Documents

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