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FNF50560TD1 Tech Specifications
ON Semiconductor FNF50560TD1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | LAST SHIPMENTS (Last Updated: 1 week ago) | |
| Factory Lead Time | 6 Weeks | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Package / Case | 20-PowerDIP Module (1.220, 31.00mm) | |
| Weight | 5.70216g | |
| Series | Motion SPM® 55 | |
| Published | 2015 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Type | IGBT | |
| Terminal Finish | Tin (Sn) | |
| Max Operating Temperature | 150°C | |
| Min Operating Temperature | -40°C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Voltage - Isolation | 1500Vrms | |
| Configuration | 3 Phase | |
| Max Current Rating | 5A | |
| Collector Emitter Voltage (VCEO) | 2.25V | |
| Min Breakdown Voltage | 600V | |
| RoHS Status | RoHS Compliant |
FNF50560TD1 Documents
Download datasheets and manufacturer documentation for FNF50560TD1
- DatasheetsFNF50560TD1 FNF50560TD1-ON-Semiconductor-datasheet-85520170.pdf
- PCN Obsolescence/ EOLMult Devices 31/Jan/2019
- ReachStatementON-Semiconductor-company-79.pdf
- Environmental InformationMaterial Declaration FNF50560TD1
- PCN Design/SpecificationLogo 17/Aug/2017
- PCN PackagingMult Devices 24/Oct/2017
- TechnicalDrawingFairchild-Semiconductor-FNF50560TD1.pdf
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