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FNB81060T3 Tech Specifications

ON Semiconductor  FNB81060T3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 2 days ago)
Factory Lead Time 8 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case 25-PowerDIP Module (0.815, 20.70mm)
Weight 3.794g
Series Motion SPM® 8
Published 2016
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 25Terminations
ECCN Code EAR99
Type IGBT
Terminal Finish Tin (Sn)
Max Operating Temperature 150°C
Min Operating Temperature -40°C
HTS Code 8541.29.00.95
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 300V
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-XDFM-T25
Voltage - Isolation 1500Vrms
Supply Voltage-Max (Vsup) 400V
Temperature Grade AUTOMOTIVE
Configuration 3 Phase
Max Current Rating 10A
Output Current-Max 20A
Collector Emitter Voltage (VCEO) 2.1V
Min Breakdown Voltage 600V
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
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FNB81060T3 Documents

Download datasheets and manufacturer documentation for   FNB81060T3

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