FNB51560T1 Tech Specifications

ON Semiconductor  FNB51560T1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status LAST SHIPMENTS (Last Updated: 2 days ago)
Factory Lead Time 6 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case 20-PowerDIP Module (1.220, 31.00mm)
Weight 5.70216g
Series Motion SPM® 55
Published 2014
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 20Terminations
ECCN Code EAR99
Type IGBT
Max Operating Temperature 150°C
Min Operating Temperature -40°C
HTS Code 8541.29.00.95
Max Power Dissipation 22W
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 15V
Frequency 20kHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-XDMA-T20
Number of Outputs 3Outputs
Qualification Status Not Qualified
Voltage - Isolation 1500Vrms
Output Voltage 600V
Operating Supply Voltage 300V
Supply Voltage-Max (Vsup) 16.5V
Power Supplies 15V
Supply Voltage-Min (Vsup) 14V
Configuration 3 Phase Inverter
Max Current Rating 15A
Operating Supply Current 2.7mA
Output Current 15A
Supply Current-Max (Isup) 4mA
Collector Emitter Voltage (VCEO) 2.2V
Min Breakdown Voltage 600V
Height Seated (Max) 6mm
Width 21mm
RoHS Status RoHS Compliant
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FNB51560T1 Documents

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