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FNB51060TD1 Tech Specifications
ON Semiconductor FNB51060TD1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 3 weeks ago) | |
| Factory Lead Time | 4 Weeks | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Package / Case | 20-PowerDIP Module (1.220, 31.00mm) | |
| Weight | 5.70216g | |
| Series | Motion SPM® 55 | |
| Published | 2015 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Type | IGBT | |
| Terminal Finish | Tin (Sn) | |
| Max Operating Temperature | 150°C | |
| Min Operating Temperature | -40°C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Reach Compliance Code | not_compliant | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Voltage - Isolation | 1500Vrms | |
| Configuration | 3 Phase Inverter | |
| Voltage | 600V | |
| Max Current Rating | 10A | |
| Collector Emitter Voltage (VCEO) | 2.15V | |
| RoHS Status | ROHS3 Compliant |
FNB51060TD1 Documents
Download datasheets and manufacturer documentation for FNB51060TD1
- DatasheetsFNB51060TD1-ON-Semiconductor-datasheet-85520152.pdf FNB51060TD1
- ReachStatementON-Semiconductor-company-79.pdf
- Environmental InformationMaterial Declaration FNB51060TD1
- PCN Design/SpecificationLogo 17/Aug/2017
- PCN PackagingMult Devices 24/Oct/2017
- TechnicalDrawingFairchild-Semiconductor-FNB51060TD1.pdf
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