FNB50560TD1 Tech Specifications

ON Semiconductor  FNB50560TD1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 2 days ago)
Factory Lead Time 13 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case 20-PowerDIP Module (1.220, 31.00mm)
Weight 5.70216g
Series Motion SPM® 55
Published 2015
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 20Terminations
ECCN Code EAR99
Type IGBT
Terminal Finish Tin (Sn)
Max Operating Temperature 150°C
Min Operating Temperature -40°C
Additional Feature ALSO REQUIRED HIGH SIDE BIAS VOLT OF 13V TO 18.5V
HTS Code 8541.29.00.95
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 15V
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-XDMA-T20
Voltage - Isolation 1500Vrms
Supply Voltage-Max (Vsup) 16.5V
Supply Voltage-Min (Vsup) 14V
Configuration 3 Phase Inverter
Max Current Rating 5A
Output Current-Max 10A
Collector Emitter Voltage (VCEO) 2.25V
Min Breakdown Voltage 600V
Length 37mm
Height Seated (Max) 6mm
Width 21mm
RoHS Status ROHS3 Compliant
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FNB50560TD1 Documents

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