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FDS6675BZ Tech Specifications

ON Semiconductor  FDS6675BZ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Factory Lead Time 18 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8Pins
Weight 130mg
Transistor Element Material SILICON
Current - Continuous Drain (Id) @ 25℃ 11A Ta
Drive Voltage (Max Rds On, Min Rds On) 4.5V 10V
Number of Elements 1 Element
Power Dissipation (Max) 2.5W Ta
Turn Off Delay Time 120 ns
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Series PowerTrench®
Published 2001
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8Terminations
Termination SMD/SMT
ECCN Code EAR99
Resistance 21.8MOhm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Position DUAL
Terminal Form GULL WING
Base Part Number FDS6675
Element Configuration Single
Operating Mode ENHANCEMENT MODE
Power Dissipation 2.5W
Turn On Delay Time 3 ns
FET Type P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 13m Ω @ 11A, 10V
Vgs(th) (Max) @ Id 3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 2470pF @ 15V
Gate Charge (Qg) (Max) @ Vgs 62nC @ 10V
Rise Time 7.8ns
Drain to Source Voltage (Vdss) 30V
Vgs (Max) ±25V
Fall Time (Typ) 60 ns
Continuous Drain Current (ID) 11A
Threshold Voltage -2V
Gate to Source Voltage (Vgs) 25V
Drain to Source Breakdown Voltage -30V
Dual Supply Voltage -30V
Nominal Vgs -2 V
Feedback Cap-Max (Crss) 500 pF
Height 1.5mm
Length 5mm
Width 4mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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