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FDC6325L
ON Semiconductor FDC6325L technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 2 days ago) | |
| Factory Lead Time | 10 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | SOT-23-6 Thin, TSOT-23-6 | |
| Number of Pins | 6Pins | |
| Weight | 36mg | |
| Operating Temperature | -55°C~150°C TJ | |
| Packaging | Tape & Reel (TR) | |
| Published | 2008 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 6Terminations | |
| ECCN Code | EAR99 | |
| Resistance | 130mOhm | |
| Terminal Finish | Tin (Sn) | |
| Power Rating | 700mW | |
| Voltage - Rated DC | 8V | |
| Max Power Dissipation | 700mW | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.95mm | |
| Current Rating | 1.8A | |
| Base Part Number | FDC6325 | |
| Number of Outputs | 1Output | |
| Output Type | P-Channel | |
| Max Output Current | 1.8A | |
| Voltage | 8V | |
| Interface | On/Off | |
| Current | 1.8A | |
| Output Configuration | High Side | |
| Power Dissipation | 700mW | |
| Output Current | 1A | |
| Voltage - Supply (Vcc/Vdd) | 1.5V~8V | |
| Input Type | Non-Inverting | |
| Switch Type | General Purpose | |
| Min Input Voltage | 2.5V | |
| Max Input Voltage | 8V | |
| Drain to Source Voltage (Vdss) | 8V | |
| Nominal Input Voltage | 8V | |
| Continuous Drain Current (ID) | 1.8A | |
| Ratio - Input:Output | 1:1 | |
| Voltage - Load | 2.5V~8V | |
| Driver Number of Bits | 1Bit | |
| Output Peak Current Limit-Nom | 1A | |
| Rds On (Typ) | 115m Ω | |
| Drain to Source Resistance | 130mOhm | |
| Height | 1mm | |
| Length | 3mm | |
| Width | 1.7mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
FDC6325L
Download datasheets and manufacturer documentation for FDC6325L
- PCN Design/SpecificationMold Compound 08/April/2008 Logo 17/Aug/2017
- PCN Assembly/OriginWafer Fab Site Add 24/Nov/2016
- DatasheetsFDC6325L
- Environmental InformationMaterial Declaration FDC6325L
- PCN PackagingBinary Year Code Marking 15/Jan/2014 Mult Devices 24/Oct/2017
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