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FDC610PZ Tech Specifications
ON Semiconductor FDC610PZ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 1 day ago) | |
| Factory Lead Time | 13 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | SOT-23-6 Thin, TSOT-23-6 | |
| Number of Pins | 6Pins | |
| Weight | 36mg | |
| Transistor Element Material | SILICON | |
| Current - Continuous Drain (Id) @ 25℃ | 4.9A Ta | |
| Drive Voltage (Max Rds On, Min Rds On) | 4.5V 10V | |
| Number of Elements | 1 Element | |
| Power Dissipation (Max) | 1.6W Ta | |
| Turn Off Delay Time | 33 ns | |
| Operating Temperature | -55°C~150°C TJ | |
| Packaging | Tape & Reel (TR) | |
| Series | PowerTrench® | |
| Published | 2006 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 6Terminations | |
| ECCN Code | EAR99 | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Number of Channels | 1Channel | |
| Element Configuration | Single | |
| Operating Mode | ENHANCEMENT MODE | |
| Power Dissipation | 1.6W | |
| Turn On Delay Time | 7 ns | |
| FET Type | P-Channel | |
| Transistor Application | SWITCHING | |
| Rds On (Max) @ Id, Vgs | 42m Ω @ 4.9A, 10V | |
| Vgs(th) (Max) @ Id | 3V @ 250μA | |
| Input Capacitance (Ciss) (Max) @ Vds | 1005pF @ 15V | |
| Gate Charge (Qg) (Max) @ Vgs | 24nC @ 10V | |
| Rise Time | 4ns | |
| Drain to Source Voltage (Vdss) | 30V | |
| Vgs (Max) | ±25V | |
| Fall Time (Typ) | 4 ns | |
| Continuous Drain Current (ID) | 4.9mA | |
| Threshold Voltage | -2.2V | |
| Gate to Source Voltage (Vgs) | 25V | |
| Drain Current-Max (Abs) (ID) | 4.9A | |
| Drain-source On Resistance-Max | 0.042Ohm | |
| Drain to Source Breakdown Voltage | -30V | |
| Max Junction Temperature (Tj) | 150°C | |
| Height | 1.1mm | |
| Length | 3mm | |
| Width | 1.7mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
FDC610PZ Documents
Download datasheets and manufacturer documentation for FDC610PZ
- PCN Design/SpecificationMold Compound 08/April/2008 Logo 17/Aug/2017
- DatasheetsFDC610PZ-ON-Semiconductor-datasheet-85466395.pdf FDC610PZ-ON-Semiconductor-datasheet-86686979.pdf FDC610PZ-ON-Semiconductor-datasheet-81454779.pdf FDC610PZ-Fairchild-Semiconductor-datasheet-67300742.pdf FDC610PZ FDC610PZ-Fairchild-datasheet-166066.pdf FDC610PZ-ON-Semiconductor-datasheet-98150707.pdf FDC610PZ-Fairchild-Semiconductor-datasheet-14042197.pdf
- PCN Assembly/OriginWafer 6/8 Inch Addition 16/Jun/2014
- Environmental InformationMaterial Declaration FDC610PZ
- PCN PackagingBinary Year Code Marking 15/Jan/2014 Mult Devices 24/Oct/2017
- ReachStatementFairchild-Semiconductor-FDC610PZ.pdf
- TechnicalDrawingFairchild-Semiconductor-FDC610PZ.pdf
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