BAS31 Tech Specifications

ON Semiconductor  BAS31 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Factory Lead Time 42 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Number of Pins 3Pins
Supplier Device Package SOT-23-3 (TO-236)
Weight 25mg
Packaging Tape & Reel (TR)
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature 150°C
Min Operating Temperature -55°C
Capacitance 35pF
Max Power Dissipation 350mW
Current Rating 200A
Base Part Number BAS31
Element Configuration Single
Speed Small Signal =< 200mA (Io), Any Speed
Diode Type Standard
Current - Reverse Leakage @ Vr 100nA @ 90V
Power Dissipation 350mW
Voltage - Forward (Vf) (Max) @ If 1.25V @ 400mA
Forward Current 200mA
Operating Temperature - Junction 150°C Max
Max Surge Current 2A
Test Current 200mA
Voltage - DC Reverse (Vr) (Max) 120V
Current - Average Rectified (Io) 200mA
Forward Voltage 1.25V
Max Reverse Voltage (DC) 120V
Average Rectified Current 200mA
Reverse Recovery Time 50 ns
Peak Reverse Current 100nA
Max Repetitive Reverse Voltage (Vrrm) 120V
Peak Non-Repetitive Surge Current 2A
Reverse Voltage 120V
Diode Configuration 1 Pair Series Connection
Max Forward Surge Current (Ifsm) 1A
Recovery Time 50 ns
Max Junction Temperature (Tj) 150°C
Height 1.2mm
Length 2.92mm
Width 1.3mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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