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BAS31 Tech Specifications
ON Semiconductor BAS31 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 1 day ago) | |
| Factory Lead Time | 42 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | TO-236-3, SC-59, SOT-23-3 | |
| Number of Pins | 3Pins | |
| Supplier Device Package | SOT-23-3 (TO-236) | |
| Weight | 25mg | |
| Packaging | Tape & Reel (TR) | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Max Operating Temperature | 150°C | |
| Min Operating Temperature | -55°C | |
| Capacitance | 35pF | |
| Max Power Dissipation | 350mW | |
| Current Rating | 200A | |
| Base Part Number | BAS31 | |
| Element Configuration | Single | |
| Speed | Small Signal =< 200mA (Io), Any Speed | |
| Diode Type | Standard | |
| Current - Reverse Leakage @ Vr | 100nA @ 90V | |
| Power Dissipation | 350mW | |
| Voltage - Forward (Vf) (Max) @ If | 1.25V @ 400mA | |
| Forward Current | 200mA | |
| Operating Temperature - Junction | 150°C Max | |
| Max Surge Current | 2A | |
| Test Current | 200mA | |
| Voltage - DC Reverse (Vr) (Max) | 120V | |
| Current - Average Rectified (Io) | 200mA | |
| Forward Voltage | 1.25V | |
| Max Reverse Voltage (DC) | 120V | |
| Average Rectified Current | 200mA | |
| Reverse Recovery Time | 50 ns | |
| Peak Reverse Current | 100nA | |
| Max Repetitive Reverse Voltage (Vrrm) | 120V | |
| Peak Non-Repetitive Surge Current | 2A | |
| Reverse Voltage | 120V | |
| Diode Configuration | 1 Pair Series Connection | |
| Max Forward Surge Current (Ifsm) | 1A | |
| Recovery Time | 50 ns | |
| Max Junction Temperature (Tj) | 150°C | |
| Height | 1.2mm | |
| Length | 2.92mm | |
| Width | 1.3mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
BAS31 Documents
Download datasheets and manufacturer documentation for BAS31
- PCN Design/SpecificationMold Compound 12/Dec/2007 Logo 17/Aug/2017
- DatasheetsBAS31-ON-Semiconductor-datasheet-85431076.pdf BAS31-ON-Semiconductor-datasheet-86683735.pdf BAS31-ON-Semiconductor-datasheet-81454729.pdf BAS31-Fairchild-Semiconductor-datasheet-68549060.pdf BAS31 BAS31-ON-Semiconductor-datasheet-94060533.pdf BAS31-Fairchild-Semiconductor-datasheet-17720616.pdf BAS31-ON-Semiconductor-datasheet-26263.pdf BAS31-Fairchild-Semiconductor-datasheet-38929817.pdf
- PCN Assembly/OriginSOT23 Manufacturing Source 31/May2013
- Environmental InformationMaterial Declaration BAS31
- PCN PackagingBinary Year Code Marking 15/Jan/2014 Mult Devices 24/Oct/2017
- RohsStatementFairchild-Semiconductor-BAS31.pdf
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