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BAS21SLT1G Tech Specifications

ON Semiconductor  BAS21SLT1G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 4 days ago)
Factory Lead Time 4 Weeks
Contact Plating Tin
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Surface Mount YES
Number of Pins 3Pins
Diode Element Material SILICON
Number of Elements 2 Elements
Packaging Cut Tape (CT)
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
ECCN Code EAR99
Max Operating Temperature 150°C
Min Operating Temperature -55°C
HTS Code 8541.10.00.70
Capacitance 5pF
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Current Rating 225mA
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number BAS21S
Pin Count 3
Element Configuration Single
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 100nA @ 200V
Power Dissipation 300mW
Voltage - Forward (Vf) (Max) @ If 1.25V @ 200mA
Forward Current 225mA
Max Reverse Leakage Current 1μA
Operating Temperature - Junction -55°C~150°C
Max Surge Current 625mA
Output Current-Max 0.225A
Halogen Free Halogen Free
Current - Average Rectified (Io) 225mA DC
Forward Voltage 1.25V
Max Reverse Voltage (DC) 250V
Average Rectified Current 225mA
Reverse Recovery Time 50 ns
Peak Reverse Current 100μA
Max Repetitive Reverse Voltage (Vrrm) 250V
Peak Non-Repetitive Surge Current 625mA
Diode Configuration 1 Pair Series Connection
Max Forward Surge Current (Ifsm) 625mA
Recovery Time 50 ns
Height 1.01mm
Length 3.04mm
Width 1.4mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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BAS21SLT1G Documents

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