BAS16DXV6T1G Tech Specifications

ON Semiconductor  BAS16DXV6T1G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 2 days ago)
Factory Lead Time 4 Weeks
Mounting Type Surface Mount
Package / Case SOT-563, SOT-666
Surface Mount YES
Number of Pins 6Pins
Diode Element Material SILICON
Number of Elements 2 Elements
Power Dissipation (Max) 0.5W
Packaging Cut Tape (CT)
Published 2005
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6Terminations
ECCN Code EAR99
Terminal Finish Tin (Sn)
Max Operating Temperature 150°C
Min Operating Temperature -55°C
HTS Code 8541.10.00.70
Capacitance 2pF
Voltage - Rated DC 75V
Terminal Form FLAT
Peak Reflow Temperature (Cel) 260
Current Rating 200mA
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number BAS16DXV6
Pin Count 6
Element Configuration Dual
Speed Small Signal =< 200mA (Io), Any Speed
Diode Type Standard
Current - Reverse Leakage @ Vr 1μA @ 75V
Voltage - Forward (Vf) (Max) @ If 1.25V @ 150mA
Forward Current 200mA
Max Reverse Leakage Current 1μA
Operating Temperature - Junction -55°C~150°C
Max Surge Current 500mA
Output Current-Max 0.2A
Halogen Free Halogen Free
Current - Average Rectified (Io) 200mA DC
Forward Voltage 1.25V
Max Reverse Voltage (DC) 75V
Average Rectified Current 200mA
Reverse Recovery Time 6 ns
Peak Reverse Current 1μA
Max Repetitive Reverse Voltage (Vrrm) 75V
Peak Non-Repetitive Surge Current 500mA
Diode Configuration 2 Independent
Max Forward Surge Current (Ifsm) 500mA
Recovery Time 6 ns
Height 600μm
Length 1.7mm
Width 1.3mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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