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4N33SR2M
ON Semiconductor 4N33SR2M technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 4 days ago) | |
| Factory Lead Time | 5 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 6-SMD, Gull Wing | |
| Number of Pins | 6Pins | |
| Weight | 810mg | |
| Collector-Emitter Saturation Voltage | 1V | |
| Current Transfer Ratio-Min | 500% @ 10mA | |
| Number of Elements | 1 Element | |
| Operating Temperature | -40°C~100°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2008 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| ECCN Code | EAR99 | |
| Additional Feature | UL APPROVED | |
| Max Power Dissipation | 250mW | |
| Base Part Number | 4N33 | |
| Voltage - Isolation | 4170Vrms | |
| Output Voltage | 60V | |
| Output Type | Darlington with Base | |
| Configuration | SINGLE | |
| Number of Channels | 1Channel | |
| Power Dissipation | 250mW | |
| Voltage - Forward (Vf) (Typ) | 1.2V | |
| Input Type | DC | |
| Optoelectronic Device Type | DARLINGTON OUTPUT OPTOCOUPLER | |
| Forward Current | 80mA | |
| Max Output Voltage | 30V | |
| Output Current per Channel | 150mA | |
| Rise Time | 5μs | |
| Fall Time (Typ) | 100 μs | |
| Collector Emitter Voltage (VCEO) | 1V | |
| Max Collector Current | 150mA | |
| Reverse Breakdown Voltage | 3V | |
| Max Input Current | 80mA | |
| Input Current | 80mA | |
| Turn On / Turn Off Time (Typ) | 5μs, 100μs (Max) | |
| Current Transfer Ratio | 500% | |
| Response Time-Max | 0.000005s | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
4N33SR2M
Download datasheets and manufacturer documentation for 4N33SR2M
- Datasheets4N29-30M,32-33M, H11B1M, TIL113M
- Environmental InformationMaterial Declaration 4N33SR2M
- PCN Design/SpecificationLogo 17/Aug/2017
- PCN PackagingMult Devices 24/Oct/2017
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