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XC56309AG100A Tech Specifications

NXP  XC56309AG100A technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 144-LQFP
Surface Mount YES
Operating Temperature -40°C~105°C TJ
Packaging Tray
Series DSP563xx
Published 2002
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144Terminations
Type Fixed Point
Additional Feature ALSO HAVING 16-BIT ALU
Terminal Position QUAD
Terminal Form GULL WING
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Base Part Number XC56309
JESD-30 Code S-PQFP-G144
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Interface Host Interface, SSI, SCI
Clock Frequency 100MHz
Address Bus Width 18
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 24
Voltage - I/O 3.30V
Barrel Shifter YES
Internal Bus Architecture MULTIPLE
Non-Volatile Memory ROM (576B)
On Chip Data RAM 24kB
Clock Rate 100MHz
Length 20mm
Height Seated (Max) 1.6mm
Width 20mm
RoHS Status ROHS3 Compliant
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XC56309AG100A Documents

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