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SPAKXC309AG100A Tech Specifications

NXP  SPAKXC309AG100A technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 144-LQFP
Operating Temperature -40°C~105°C TJ
Packaging Tray
Series DSP563xx
Published 2005
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Fixed Point
Base Part Number SPAKXC309
Interface Host Interface, SSI, SCI
Voltage - I/O 3.30V
Non-Volatile Memory ROM (576B)
On Chip Data RAM 24kB
Clock Rate 100MHz
RoHS Status ROHS3 Compliant
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SPAKXC309AG100A Documents

Download datasheets and manufacturer documentation for   SPAKXC309AG100A

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