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- NX3L2T66GM,125
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NX3L2T66GM,125 Tech Specifications
NXP NX3L2T66GM,125 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 7 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-XFQFN Exposed Pad | |
| Operating Temperature | -40°C~125°C TA | |
| Packaging | Tape & Reel (TR) | |
| Published | 2010 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Base Part Number | NX3L2T66G | |
| Pin Count | 8 | |
| Number of Circuits | 2Circuits | |
| -3db Bandwidth | 60MHz | |
| On-State Resistance (Max) | 750mOhm | |
| Multiplexer/Demultiplexer Circuit | 1:1 | |
| Current - Leakage (IS(off)) (Max) | 10nA | |
| Channel Capacitance (CS(off), CD(off)) | 35pF | |
| Switch Circuit | SPST - NO | |
| Switch Time (Ton, Toff) (Max) | 28ns, 20ns | |
| Charge Injection | 6pC | |
| Channel-to-Channel Matching (ΔRon) | 20m Ω | |
| Voltage - Supply, Single (V+) | 1.4V~4.3V | |
| RoHS Status | ROHS3 Compliant |
NX3L2T66GM,125 Documents
Download datasheets and manufacturer documentation for NX3L2T66GM,125
- DatasheetsNX3L2T66
- Environmental InformationNXP RoHS3 Cert
- PCN PackagingDate Code Extended 18/Jul/2013
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