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MSC8157ESAG1000A Tech Specifications

NXP  MSC8157ESAG1000A technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 783-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~105°C TJ
Packaging Tray
Series StarCore
Published 2008
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 783Terminations
ECCN Code 5A002.A
Type SC3850 Six Core
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B783
Qualification Status Not Qualified
Power Supplies 11.52.5V
Interface Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Bit Size 32
Format FLOATING-POINT
RAM (words) 8192
Voltage - I/O 1.0V 1.5V 2.5V
Non-Volatile Memory ROM (96kB)
Voltage - Core 1.00V
On Chip Data RAM 6.375MB
Clock Rate 1GHz
RoHS Status ROHS3 Compliant
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MSC8157ESAG1000A Documents

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