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- MPXV8510DK016T1
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MPXV8510DK016T1 Tech Specifications
NXP MPXV8510DK016T1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Package / Case | 32-QFN Exposed Pad | |
| Surface Mount | YES | |
| Operating Temperature | -40°C~125°C | |
| Packaging | Tray | |
| Published | 2017 | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 32Terminations | |
| Applications | TPM (Tire Pressure Monitor) | |
| Voltage - Supply | 2.3V~3.6V | |
| Terminal Position | QUAD | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Supply Voltage | 3V | |
| Terminal Pitch | 0.65mm | |
| Frequency | 315MHz 434MHz | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | S-XQCC-N32 | |
| Memory Size | 8kB Flash 512B SRAM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Data Interface | PCB, Surface Mount | |
| Modulation or Protocol | FSK, OOK | |
| Antenna Connector | PCB, Surface Mount | |
| Length | 9mm | |
| Height Seated (Max) | 2.3mm | |
| Width | 9mm | |
| RoHS Status | ROHS3 Compliant |
MPXV8510DK016T1 Documents
Download datasheets and manufacturer documentation for MPXV8510DK016T1
- PCN Assembly/OriginFlip Burn In Testing 10/Jul/2014
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