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MPXC2011DT1 Tech Specifications
NXP MPXC2011DT1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 12 Weeks | |
| Package / Case | 4-SSIP Module | |
| Surface Mount | NO | |
| Mounting Feature | THROUGH HOLE MOUNT | |
| Operating Temperature | 15°C~40°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2008 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | Not Applicable | |
| ECCN Code | EAR99 | |
| Applications | Board Mount | |
| HTS Code | 8542.31.00.01 | |
| Voltage - Supply | 3V~10V | |
| Output | 0 mV ~ 25 mV (10V) | |
| Termination Style | PC Pin | |
| Body Length or Diameter | 6.35mm | |
| Body Breadth | 3.68 mm | |
| Output Type | Wheatstone Bridge | |
| Response Time | 1000 µs | |
| Operating Pressure | 1.45PSI (10kPa) | |
| Pressure Type | Differential | |
| Port Style | Barbless | |
| Linearity | 1 % | |
| Maximum Pressure | 10.88PSI (75kPa) | |
| Sensors/Transducers Type | PRESSURE SENSOR,PEIZORESISTIVE | |
| Pressure Range-Max | 1.45 Psi | |
| Accuracy-Max | 1% | |
| Offset-Nom | 0V | |
| Features | Temperature Compensated | |
| Sensitivity (mV/V) | 2.5 mV/V | |
| Body Height | 9.14mm | |
| RoHS Status | ROHS3 Compliant |
MPXC2011DT1 Documents
Download datasheets and manufacturer documentation for MPXC2011DT1
- PCN Packaging12NC 27/Nov/2016
- DatasheetsMPXC2011,12DT1
- Environmental InformationNXP RoHS3 Cert
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