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MPX2300DT1 Tech Specifications

NXP  MPX2300DT1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Package / Case 4-SSIP Module
Surface Mount NO
Mounting Feature THROUGH HOLE MOUNT
Operating Temperature 15°C~40°C
Packaging Tape & Reel (TR)
Series MPX2300
Published 2011
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
ECCN Code EAR99
Applications Board Mount
HTS Code 8542.39.00.01
Voltage - Supply 6V~10V
Output 0 mV ~ 3.006 mV (6V)
Termination Style PC Pin
Body Length or Diameter 6.35mm
Body Breadth 3.68 mm
Output Type Wheatstone Bridge
Accuracy ±1.5%
Response Time 1000 μs
Operating Pressure 5.8PSI (40kPa)
Pressure Type Differential
Port Style No Port
Linearity 1.5 %
Maximum Pressure 125PSI (861.84kPa)
Sensors/Transducers Type PRESSURE SENSOR,PEIZORESISTIVE
Pressure Range-Max 5.8 Psi
Offset-Nom 0MV
Features Temperature Compensated
Sensitivity (mV/V) 0.005 mV/V
Body Height 9.14mm
RoHS Status ROHS3 Compliant
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MPX2300DT1 Documents

Download datasheets and manufacturer documentation for   MPX2300DT1

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