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MPC8358ECVRAGDGA Tech Specifications

NXP  MPC8358ECVRAGDGA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Package / Case 668-BBGA Exposed Pad
Surface Mount YES
Operating Temperature -40°C~105°C TA
Packaging Tray
Series MPC83xx
Published 2002
JESD-609 Code e2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 668Terminations
ECCN Code 5A002.A.1
Terminal Finish TIN COPPER/TIN SILVER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC8358
JESD-30 Code S-PBGA-B668
Supply Voltage-Max (Vsup) 1.26V
Supply Voltage-Min (Vsup) 1.14V
Speed 400MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC e300
Clock Frequency 66.67MHz
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 1.8V 2.5V 3.3V
Ethernet 10/100/1000Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR, DDR2
USB USB 1.x (1)
Additional Interfaces DUART, HDLC, I2C, PCI, SPI, UART
Co-Processors/DSP Communications; QUICC Engine, Security; SEC
Security Features Cryptography, Random Number Generator
Length 29mm
Height Seated (Max) 2.46mm
RoHS Status ROHS3 Compliant
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MPC8358ECVRAGDGA Documents

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