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MM912KS812AMAF Tech Specifications

NXP  MM912KS812AMAF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 18 Weeks
Mounting Type Surface Mount
Package / Case 100-LQFP Exposed Pad
Surface Mount YES
Number of I/Os 6I/Os
Operating Temperature -40°C~125°C
Packaging Tray
Published 2011
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin (Sn)
Applications Engine Control
HTS Code 8542.39.00.01
Voltage - Supply 4.7V~36V
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PQFP-G100
Interface CAN, SCI, SPI
RAM Size 12K x 8
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor S12XS
Program Memory Type FLASH (256kB)
Controller Series HCS12
Length 14mm
Width 14mm
RoHS Status ROHS3 Compliant
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MM912KS812AMAF Documents

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