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MM908E625ACPEKR2 Tech Specifications

NXP  MM908E625ACPEKR2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 18 Weeks
Mounting Type Surface Mount
Package / Case 54-SSOP (0.295, 7.50mm Width) Exposed Pad
Surface Mount YES
Number of I/Os 13I/Os
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Published 2003
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 54Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
Applications Automotive Mirror Control
HTS Code 8542.31.00.01
Voltage - Supply 8V~18V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 12V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code R-PDSO-G54
Interface SCI, SPI
Speed 32 MHz
RAM Size 512 x 8
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor HC08
Clock Frequency 9.8304MHz
Program Memory Type FLASH (16kB)
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Controller Series 908E
Length 17.9mm
Height Seated (Max) 2.45mm
Width 7.5mm
RoHS Status ROHS3 Compliant
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MM908E625ACPEKR2 Documents

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