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MM908E625ACPEK Tech Specifications

NXP  MM908E625ACPEK technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 18 Weeks
Mounting Type Surface Mount
Package / Case 54-SSOP (0.295, 7.50mm Width) Exposed Pad
Surface Mount YES
Number of I/Os 13I/Os
ROM(word) 16384
Operating Temperature -40°C~85°C
Packaging Tube
Published 2003
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 54Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
Applications Automotive Mirror Control
HTS Code 8542.31.00.01
Voltage - Supply 8V~18V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 12V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MM908E625
JESD-30 Code R-PDSO-G54
Qualification Status Not Qualified
Power Supplies 9/16V
Interface SCI, SPI
Speed 32 MHz
RAM Size 512 x 8
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor HC08
Clock Frequency 9.8304MHz
Program Memory Type FLASH (16kB)
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Controller Series 908E
Length 17.9mm
Height Seated (Max) 2.45mm
Width 7.5mm
RoHS Status ROHS3 Compliant
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