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DSPB56725AF Tech Specifications

NXP  DSPB56725AF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 80-QFP
Surface Mount YES
Usage Level Commercial grade
Operating Temperature 0°C~70°C TA
Packaging Tray
Series DSP56K/Symphony
Published 2006
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 80Terminations
ECCN Code 3A991.A.2
Type Audio Processor
Terminal Finish Matte Tin (Sn)
Additional Feature ALSO REQUIRES 3.3V I/O SUPPLY
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number DSPB56725
JESD-30 Code S-PQFP-G80
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Supply Voltage-Min (Vsup) 1.14V
Interface Host Interface, I2C, SAI, SPI
Clock Frequency 200MHz
Boundary Scan YES
Low Power Mode NO
Format FIXED POINT
Voltage - I/O 3.30V
Barrel Shifter NO
Internal Bus Architecture MULTIPLE
Non-Volatile Memory External
Voltage - Core 1.20V
On Chip Data RAM 112kB
Clock Rate 250MHz
Length 14mm
Height Seated (Max) 1.6mm
Width 14mm
RoHS Status ROHS3 Compliant
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DSPB56725AF Documents

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