DSPB56374AFC Tech Specifications

NXP  DSPB56374AFC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 80-LQFP
Surface Mount YES
Operating Temperature -40°C~85°C TA
Packaging Tray
Series DSP56K/Symphony
Published 1996
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 80Terminations
ECCN Code 3A991.A.2
Type Audio Processor
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.25V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number DSPB56374
JESD-30 Code S-PQFP-G80
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.3V
Supply Voltage-Min (Vsup) 1.2V
Interface Host Interface, I2C, SAI, SPI
Clock Frequency 149.9MHz
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
Voltage - I/O 3.30V
Barrel Shifter YES
Internal Bus Architecture MULTIPLE
Non-Volatile Memory ROM (84kB)
Voltage - Core 1.25V
On Chip Data RAM 54kB
Clock Rate 150MHz
Length 14mm
Height Seated (Max) 1.6mm
Width 14mm
RoHS Status ROHS3 Compliant
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