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DSP56303AG100R2 Tech Specifications

NXP  DSP56303AG100R2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 144-LQFP
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tape & Reel (TR)
Series DSP563xx
Published 2005
JESD-609 Code e3
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144Terminations
ECCN Code 3A991.A.2
Type Fixed Point
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number DSP56303
JESD-30 Code S-PQFP-G144
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Interface Host Interface, SSI, SCI
Clock Frequency 100MHz
Address Bus Width 18
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 24
Voltage - I/O 3.30V
Barrel Shifter YES
Internal Bus Architecture MULTIPLE
Non-Volatile Memory ROM (576B)
On Chip Data RAM 24kB
Clock Rate 100MHz
Length 20mm
Height Seated (Max) 1.6mm
Width 20mm
RoHS Status ROHS3 Compliant
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DSP56303AG100R2 Documents

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