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BF556A,215 Tech Specifications

NXP  BF556A,215 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 8 Weeks
Surface Mount YES
Package / Case TO-236-3, SC-59, SOT-23-3
Transistor Element Material SILICON
Voltage Rated 30V
Operating Temperature (Max.) 150°C
Number of Elements 1 Element
Published 2001
Packaging Tape & Reel (TR)
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
Terminal Finish TIN
HTS Code 8541.21.00.75
Current Rating (Amps) 7mA
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number BF556
Pin Count 3
JESD-30 Code R-PDSO-G3
Qualification Status Not Qualified
Configuration SINGLE
Operating Mode DEPLETION MODE
Transistor Application AMPLIFIER
Transistor Type N-Channel JFET
JEDEC-95 Code TO-236AB
DS Breakdown Voltage-Min 30V
FET Technology JUNCTION
Power Dissipation-Max (Abs) 0.25W
Highest Frequency Band VERY HIGH FREQUENCY B
RoHS Status ROHS3 Compliant
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BF556A,215 Documents

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