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BBY40,215 Tech Specifications

NXP  BBY40,215 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 13 Weeks
Package / Case TO-236-3, SC-59, SOT-23-3
Surface Mount YES
Mounting Type Surface Mount
Diode Element Material SILICON
Number of Elements 1 Element
Operating Temperature -55°C~125°C TJ
Packaging Tape & Reel (TR)
Published 1996
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
ECCN Code EAR99
Terminal Finish Tin (Sn)
HTS Code 8541.10.00.70
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number BBY40
Pin Count 3
JESD-30 Code R-PDSO-G3
Qualification Status Not Qualified
Diode Type Single
Capacitance @ Vr, F 6pF @ 25V 1MHz
Reverse Current-Max 0.01μA
Voltage - Peak Reverse (Max) 30V
Breakdown Voltage-Min 30V
Reverse Test Voltage 28V
Frequency Band VERY HIGH FREQUENCY
Diode Capacitance-Nom 26pF
Capacitance Ratio 6.5
Capacitance Ratio Condition C3/C25
RoHS Status ROHS3 Compliant
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BBY40,215 Documents

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