BBY40 Tech Specifications

NXP  BBY40 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Surface Mount
Surface Mount YES
Number of Pins 3Pins
Diode Element Material SILICON
Number of Terminals 3Terminals
RoHS Compliant
Package Description R-PDSO-G3
Package Style SMALL OUTLINE
Moisture Sensitivity Levels 1
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -55 °C
Reflow Temperature-Max (s) 30
Operating Temperature-Max 125 °C
Rohs Code Yes
Manufacturer Part Number BBY40
Package Shape RECTANGULAR
Manufacturer NXP Semiconductors
Number of Elements 1 Element
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Risk Rank 0.71
Packaging Cut Tape
JESD-609 Code e3
Pbfree Code Yes
ECCN Code EAR99
Terminal Finish TIN (SN)
Max Operating Temperature 125 °C
Min Operating Temperature -55 °C
HTS Code 8541.10.00.70
Subcategory Varactors
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Reach Compliance Code compliant
Pin Count 3
JESD-30 Code R-PDSO-G3
Qualification Status Not Qualified
Configuration SINGLE
Element Configuration Single
Diode Type VARIABLE CAPACITANCE DIODE
Forward Current 20 mA
Max Repetitive Reverse Voltage (Vrrm) 30 V
Rep Pk Reverse Voltage-Max 30 V
JEDEC-95 Code TO-236AB
Reverse Current-Max 0.01 µA
Breakdown Voltage-Min 30 V
Reverse Test Voltage 28 V
Frequency Band VERY HIGH FREQUENCY
Diode Capacitance-Nom 29 pF
Diode Cap Tolerance 10.34%
Variable Capacitance Diode Classification ABRUPT
Diode Capacitance Ratio-Min 5
Length 3 mm
Height 1 mm
Width 1.4 mm
Radiation Hardening No
REACH SVHC No SVHC
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