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BB208-02,135 Tech Specifications

NXP  BB208-02,135 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case SC-79, SOD-523
Surface Mount YES
Diode Element Material SILICON
Number of Elements 1 Element
Operating Temperature -55°C~125°C TJ
Packaging Tape & Reel (TR)
Published 2003
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
ECCN Code EAR99
Terminal Finish Tin (Sn)
HTS Code 8541.10.00.70
Terminal Position DUAL
Terminal Form FLAT
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number BB208
Pin Count 2
JESD-30 Code R-PDSO-F2
Qualification Status Not Qualified
Diode Type Single
Capacitance @ Vr, F 5.4pF @ 7.5V 1MHz
Voltage - Peak Reverse (Max) 10V
Diode Capacitance-Nom 10.1pF
Capacitance Ratio 5.2
Capacitance Ratio Condition C1/C7.5
RoHS Status ROHS3 Compliant
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BB208-02,135 Documents

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