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BB178,115 Tech Specifications

NXP  BB178,115 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case SC-79, SOD-523
Surface Mount YES
Diode Element Material SILICON
Number of Elements 1 Element
Operating Temperature -55°C~125°C TJ
Packaging Tape & Reel (TR)
Published 2004
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
ECCN Code EAR99
Terminal Finish Tin (Sn)
Additional Feature 2% MATCHED SETS OF 10 DIODES ARE AVAILABLE
HTS Code 8541.10.00.70
Terminal Position DUAL
Terminal Form FLAT
Peak Reflow Temperature (Cel) 260
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number BB178
Pin Count 2
JESD-30 Code R-PDSO-F2
Qualification Status Not Qualified
Diode Type Single
Capacitance @ Vr, F 2.754pF @ 28V 1MHz
Voltage - Peak Reverse (Max) 32V
Breakdown Voltage-Min 32V
Frequency Band VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
Diode Capacitance-Nom 38.5pF
Capacitance Ratio 15
Capacitance Ratio Condition C1/C28
RoHS Status ROHS3 Compliant
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BB178,115 Documents

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