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XPC755BPX350LD Tech Specifications

pSemi  XPC755BPX350LD technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 360Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description BGA,
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.9 V
Supply Voltage-Nom 2 V
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Reach Compliance Code unknown
JESD-30 Code R-PBGA-B360
Speed 350 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Boundary Scan YES
Low Power Mode NO
Format FIXED POINT
Integrated Cache NO
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XPC755BPX350LD Documents

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