TEA1069H Tech Specifications

pSemi  TEA1069H technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 44Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code QFP
Package Description PLASTIC, QFP-44
Moisture Sensitivity Levels 1
Operating Temperature-Max 75 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code QFP44,.5SQ,32
Package Shape SQUARE
Package Style FLATPACK
Supply Voltage-Nom 2.7 V
Pbfree Code No
Additional Feature 3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT
HTS Code 8542.39.00.01
Terminal Position QUAD
Terminal Form GULL WING
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Pin Count 44
JESD-30 Code S-PQFP-G44
Qualification Status Not Qualified
Temperature Grade COMMERCIAL EXTENDED
Supply Current-Max 0.0018 mA
Seated Height-Max 2.1 mm
Telecom IC Type TELEPHONE MULTIFUNCTION CIRCUIT
Make-break Ratio 2:1
Length 10 mm
Width 10 mm
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TEA1069H Documents

Download datasheets and manufacturer documentation for   TEA1069H

  • Datasheets
TEA1069H brand manufacturers: NXP Semiconductors, Twicea stock, TEA1069H reference price.NXP Semiconductors. TEA1069H parameters, TEA1069H Datasheet PDF and pin diagram description download.You can use the TEA1069H Interface - Telecom, DSP Datesheet PDF, find TEA1069H pin diagram and circuit diagram and usage method of function,TEA1069H electronics tutorials.You can download from the Twicea.