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SJA1105PEL Tech Specifications

NXP  SJA1105PEL technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact plating gold-plated
Surface Mount YES
Number of pins 10pins
Number of Terminals 159Terminals
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting SMT
Connector pinout layout 1x10
Gross weight 0.57 g
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description BGA,
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA159,14X14,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Supply Voltage-Nom 1.2 V
Operating temperature -40...163°C
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Current rating 3A
JESD-30 Code S-PBGA-B159
Temperature Grade INDUSTRIAL
Supply Current-Max 200 mA
Seated Height-Max 1.5 mm
Screening Level AEC-Q100; ISO 26262
Telecom IC Type ETHERNET SWITCH
Rated voltage 150V
Profile beryllium copper
Length 12 mm
Width 12 mm
Plating thickness 0.75µm
Flammability rating UL94V-0
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SJA1105PEL Documents

Download datasheets and manufacturer documentation for   SJA1105PEL

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