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S9S08DZ60F2MLC

pSemi  S9S08DZ60F2MLC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Surface Mount YES
Number of Terminals 32Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description LQFP-32
Clock Frequency-Max 16 MHz
Moisture Sensitivity Levels 3
Number of I/O Lines 26I/O Lines
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LQFP
Package Equivalence Code QFP32,.35SQ,32
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE
RAM(byte) 4096
ROM(word) 60032
Supply Voltage-Max 5.5 V
Supply Voltage-Min 2.7 V
Supply Voltage-Nom 3 V
JESD-609 Code e3
Pbfree Code Yes
ECCN Code 3A991.A.2
Terminal Finish Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PQFP-G32
Speed 40 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Supply Current-Max 24 mA
Bit Size 8
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Seated Height-Max 1.6 mm
On Chip Program ROM Width 8
CPU Family HCS08
Boundary Scan NO
Low Power Mode YES
Format FIXED POINT
Integrated Cache NO
Number of Serial I/Os 2Serial I/Os
Number of Timers 2Timers
ROM Programmability FLASH
Number of External Interrupts 1External Interrupt
On Chip Data RAM Width 8
Length 7 mm
Width 7 mm

S9S08DZ60F2MLC

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