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PCD3327CP Tech Specifications

pSemi  PCD3327CP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Number of Terminals 18Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description DIP,
Operating Temperature-Max 70 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom 3 V
Additional Feature SELECTABLE MAKE/BREAK RATIO 1:2
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
JESD-30 Code R-PDIP-T18
Qualification Status Not Qualified
Temperature Grade OTHER
Supply Current-Max 0.4 mA
Seated Height-Max 4.7 mm
Telecom IC Type TELEPHONE DIALER CIRCUIT
Make-break Ratio 1:1.5
Length 21.6 mm
Width 7.62 mm
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PCD3327CP Documents

Download datasheets and manufacturer documentation for   PCD3327CP

PCD3327CP brand manufacturers: NXP Semiconductors, Twicea stock, PCD3327CP reference price.NXP Semiconductors. PCD3327CP parameters, PCD3327CP Datasheet PDF and pin diagram description download.You can use the PCD3327CP Interface - Telecom, DSP Datesheet PDF, find PCD3327CP pin diagram and circuit diagram and usage method of function,PCD3327CP electronics tutorials.You can download from the Twicea.