NXP Semiconductors MPC8360EVVALFHA Embedded Microprocessors 667 MHz
MPC8360EVVALFHA
1964-490-MPC8360EVVALFHA
RoHS Compliant
uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
In Stock Min. : 1
Mult. : 1
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MPC8360EVVALFHA Tech Specifications
pSemi MPC8360EVVALFHA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 4 Weeks | |
| Surface Mount | YES | |
| Number of Terminals | 740Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-740 | |
| Clock Frequency-Max | 66.67 MHz | |
| Moisture Sensitivity Levels | 3 | |
| Operating Temperature-Max | 70 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA740,37X37,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Supply Voltage-Max | 1.35 V | |
| Supply Voltage-Min | 1.25 V | |
| Supply Voltage-Nom | 1.3 V | |
| JESD-609 Code | e2 | |
| ECCN Code | 5A002.A.1 | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| JESD-30 Code | S-PBGA-B740 | |
| Qualification Status | Not Qualified | |
| Speed | 667 MHz | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC | |
| Bit Size | 32 | |
| Seated Height-Max | 1.69 mm | |
| Address Bus Width | 32 | |
| Boundary Scan | YES | |
| Low Power Mode | YES | |
| External Data Bus Width | 32 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| Length | 37.5 mm | |
| Width | 37.5 mm |
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