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MPC5534MVZ66

pSemi  MPC5534MVZ66 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 324Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description 23 X 23 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAJ-1, BGA-324
Clock Frequency-Max 20 MHz
Number of I/O Lines 4I/O Lines
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA324,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
RAM(byte) 65536
ROM(word) 1048576
Supply Voltage-Max 1.65 V
Supply Voltage-Min 1.35 V
Supply Voltage-Nom 1.5 V
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
Temperature Grade AUTOMOTIVE
Speed 66 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Supply Current-Max 250 mA
Bit Size 32
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Seated Height-Max 2.55 mm
On Chip Program ROM Width 8
ROM Programmability FLASH
Length 23 mm
Width 23 mm

MPC5534MVZ66

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