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74HC2G34GW,125 Tech Specifications
NXP 74HC2G34GW,125 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| HTS | 8542.39.00.01 | |
| ECCN (US) | EAR99 | |
| Number of Output Enables per Chip | 0 | |
| Number of Outputs per Chip | 2Outputs per Chips | |
| Number of Input Enables per Chip | 0 | |
| Number of Inputs per Chip | 2Inputs per Chips | |
| Number of Channels per Chip | 2Channels per Chips | |
| Number of Elements per Chip | 2Elements per Chips | |
| Logic Family | HC | |
| Maximum Operating Temperature (°C) | 125 | |
| Minimum Operating Temperature (°C) | -40 | |
| Maximum Power Dissipation (mW) | 250 | |
| Propagation Delay Test Condition (pF) | 50 | |
| Maximum Quiescent Current (uA) | 1 | |
| Maximum Operating Supply Voltage (V) | 6 | |
| Typical Operating Supply Voltage (V) | 5 | |
| Minimum Operating Supply Voltage (V) | 2 | |
| Maximum High Level Output Current (mA) | -5.2 | |
| Maximum Low Level Output Current (mA) | 5.2 | |
| Input Signal Type | Single-Ended | |
| Process Technology | CMOS | |
| Absolute Propagation Delay Time (ns) | 125 | |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 75@2V|15@4.5V|13@6V | |
| Bus Hold | No | |
| Package Width | 1.35(Max) | |
| Package Length | 2.2(Max) | |
| Package Height | 1(Max) | |
| Mounting | Surface Mount | |
| Supplier Package | TSSOP | |
| PCB changed | 6 | |
| Packaging | Tape and Reel | |
| Part Status | Active | |
| Pin Count | 6 | |
| Polarity | Non-Inverting | |
| Logic Function | Buffer | |
| RoHS Status | RoHS Compliant |
74HC2G34GW,125 Documents
Download datasheets and manufacturer documentation for 74HC2G34GW,125
- datasheetsnexperia-74hc2g34gw125-datasheets-7123.pdf
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