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MSCMMX6QZDK08AB

NXP  MSCMMX6QZDK08AB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 500Terminals
Package Description FBGA,
Package Style GRID ARRAY, FINE PITCH
Moisture Sensitivity Levels 3
Package Body Material PLASTIC/EPOXY
Reflow Temperature-Max (s) NOT SPECIFIED
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number MSCMMX6QZDK08AB
Package Code FBGA
Package Shape RECTANGULAR
Manufacturer NXP Semiconductors
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Risk Rank 5.83
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.65 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B500
Temperature Grade OTHER
Speed 800 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Seated Height-Max 1.8 mm
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
Integrated Cache YES
Width 14 mm
Length 17 mm
MSCMMX6QZDK08AB brand manufacturers: NXP, Twicea stock, MSCMMX6QZDK08AB reference price.NXP. MSCMMX6QZDK08AB parameters, MSCMMX6QZDK08AB Datasheet PDF and pin diagram description download.You can use the MSCMMX6QZDK08AB Embedded - System On Chip (SoC), DSP Datesheet PDF, find MSCMMX6QZDK08AB pin diagram and circuit diagram and usage method of function,MSCMMX6QZDK08AB electronics tutorials.You can download from the Twicea.