NXP MFS8416AMBP5ES Specialized Modules Backshell, Heat Shrink Adapter
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MFS8416AMBP5ES Tech Specifications
NXP MFS8416AMBP5ES technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Material | Aluminum Alloy | |
| For Use With/Related Products | MIL-DTL-38999 Series III, IV | |
| Lead Free Status / RoHS Status | -- | |
| Factory Pack QuantityFactory Pack Quantity | 260 | |
| Part # Aliases | 935418696557 | |
| Manufacturer | NXP | |
| Brand | NXP Semiconductors | |
| RoHS | Details | |
| Series | 209M3 | |
| Packaging | Tray | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | -- | |
| Type | Backshell, Heat Shrink Adapter | |
| Color | Silver | |
| Subcategory | PMIC - Power Management ICs | |
| Shielding | Unshielded | |
| Ingress Protection | Environment Resistant | |
| Shell Size - Insert | 23, H | |
| Plating | Electroless Nickel | |
| Cable Opening | -- | |
| Thread Size | M34x1 | |
| Product Type | Power Management Specialized - PMIC | |
| Includes | 2 pcs - 1 Backshell, 1 O-Ring | |
| Cable Exit | 180° | |
| Features | -- | |
| Product Category | Power Management Specialized - PMIC | |
| Diameter - Outside | 1.625 (41.28mm) | |
| Material Flammability Rating | -- |
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