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- HVP-56F81768
In Stock Min. : 1
Mult. : 1
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HVP-56F81768 Tech Specifications
NXP HVP-56F81768 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Contact Plating | Tin | |
| Number of Pins | 2Pins | |
| RoHS | Compliant | |
| Factory Pack QuantityFactory Pack Quantity | 1 | |
| Manufacturer | NXP | |
| Brand | NXP Semiconductors | |
| Packaging | Bulk | |
| Tolerance | 1 % | |
| Temperature Coefficient | 75 ppm/°C | |
| Resistance | 160 mΩ | |
| Max Operating Temperature | 170 °C | |
| Min Operating Temperature | -65 °C | |
| Composition | Metal Strip | |
| Power Rating | 500 mW | |
| Product Category | NXP Semiconductors | |
| Width | 2.54 mm | |
| Height | 635 µm | |
| Length | 5.08 mm | |
| Radiation Hardening | No | |
| Lead Free | Lead Free |
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