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74LVC827APW Tech Specifications

NXP  74LVC827APW technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 24Terminals
Package Description TSSOP, TSSOP24,.25
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Package Body Material PLASTIC/EPOXY
Package Equivalence Code TSSOP24,.25
Operating Temperature-Min -40 °C
Operating Temperature-Max 85 °C
Rohs Code No
Manufacturer Part Number 74LVC827APW
Supply Voltage-Nom (Vsup) 3.3 V
Package Code TSSOP
Package Shape RECTANGULAR
Manufacturer Philips Semiconductors
Part Life Cycle Code Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS
Risk Rank 8.07
Prop. 7 ns
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)
Subcategory Bus Driver/Transceivers
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Number of Functions 1Function
Terminal Pitch 0.635 mm
Reach Compliance Code unknown
JESD-30 Code R-PDSO-G24
Qualification Status Not Qualified
Power Supplies 3.3 V
Temperature Grade INDUSTRIAL
Number of Bits 10Bits
Output Characteristics 3-STATE
Output Polarity TRUE
Logic IC Type BUS DRIVER
Max I(ol) 0.024 A
Control Type ENABLE LOW
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